BESCO INFRATECH PRIVATE LIMITED
BESCO INFRATECH PRIVATE LIMITED is a Private Limited Company, incorporated under the Companies Act as a Company limited by Shares. It is classified as Non-govt company and is registered at RoC-Delhi.
There are 2 promoter(s) of the company viz.UNNIKRISHNA DIVAKARAN PILLAI, SHASWAT TANTIA .
BESCO INFRATECH PRIVATE LIMITED Annual General Meeting (AGM) was last held on as per records from the Ministry of Corporate Affairs (MCA).
Financial Details & Insights
The authorized share capital of the company is Rs.1,00,00,000 and its paid up capital is Rs.2,10,000. Its balance sheet was last filed on 31-03-2022. BESCO INFRATECH PRIVATE LIMITED Corporate Identification Number (CIN) is U45201HR2005PTC035743 and its registration number is 035743.
Contact Details & Insights
You can contact them by emailing at bescoinfra01@gmail.com. The companies registered address is 13/4, MATHURA ROAD FARIDABAD HR 121003 IN.
Other Details & Information
BESCO INFRATECH PRIVATE LIMITED's status is Active as per the records. The company is Unlisted.
CIN | U45201HR2005PTC035743 |
Company Name | BESCO INFRATECH PRIVATE LIMITED |
ROC Code | RoC-Delhi |
Registration Number | 035743 |
Company Category | Company limited by Shares |
Company SubCategory | Non-govt company |
Class of Company | Private |
Authorised Capital(Rs) | 1,00,00,000 |
Paid up Capital(Rs) | 2,10,000 |
Number of Members (Applicable in case of company without Share Capital) | 0 |
Date of Incorporation | 25-05-2005 |
Registered Address | 13/4, MATHURA ROAD FARIDABAD HR 121003 IN |
Address other than R/o where all or any books of account and papers are maintained | - |
Email Id | bescoinfra01@gmail.com |
Whether Listed or not | Unlisted |
Suspended at stock exchange | - |
Date of Last AGM | 30-09-2022 |
Date of Balance Sheet | 31-03-2022 |
Company Status (for efiling) | Active |
Last Updated On | 15-05-2023 |
Directors/Signatory Details
DIN/PAN | Name | Begin Date |
---|---|---|
00654623 | UNNIKRISHNA DIVAKARAN PILLAI | 10-12-2015 |
03165559 | SHASWAT TANTIA | 26-07-2010 |